Electronics & PCB Assembly Analytics | QualityLine
Electronics & PCB Assembly

Your SMT line detects
every defect.
Your systems can't agree on why.

AOI flags defects. SPI measures paste. ICT catches failures. X-Ray confirms hidden issues. But none of these systems connect the full production story — and none of them can tell you what caused the yield drop you're investigating right now.

Request a Demo →
Cross-System Correlation
SPI
Reflow
AOI
ICT
X-Ray
MES
ERP
Sensors
Root Cause Identified
Stencil aperture offset — U14 pad array
Correlates with SPI variance 6hr before ICT failures on boards 4,812–4,849
92%
Up to 30% improvement in production yield
50% reduction in customer returns
1,000+ manufacturing lines connected globally
No replacement of existing systems required
Industry Reality

Electronics manufacturing doesn't lack data.
It lacks connection between systems.

A modern SMT line generates data at every stage:

Pick & Place · AOI · ICT · SPI · Flying Probe · X-Ray · Reflow · FCT · Repair · MES · ERP · Sensors

Each system captures a part of the process. None of them explain what's happening across the entire production flow.

Each system works as intended.
The gap exists between them.

First pass yield drops — without a clear explanation
Defects appear downstream, but originate upstream
AOI and ICT results don't align
The same issues repeat across shifts and lines
Engineers spend hours comparing logs instead of solving problems
NPI ramp introduces new variables — with no historical correlation
Why Current Systems Fall Short

Your systems detect problems.
They were never designed to explain them.

SPI
Measures paste — doesn't predict defects
Volume and alignment data is captured per deposit. There's no mechanism to connect it to downstream solder outcomes or flag at-risk boards before reflow.
AOI
Detects issues — lacks process context
Optical inspection generates thousands of results per shift. Without upstream data, every flagged defect starts a fresh investigation with no starting point.
ICT / Flying Probe
Catches failures — can't trace origin
In-circuit test finds the failure at the point of detection. It has no visibility into what happened three stations earlier that caused it.
X-Ray
Confirms defects — doesn't explain conditions
X-ray validates hidden joints and identifies voids. It cannot connect those findings to the reflow profile, paste lot, or board preheating variation that produced them.
MES
Tracks production — not relationships between events
Your MES records what was built and when. It wasn't designed to correlate process parameters with quality outcomes across stations.
ERP
Tracks materials — not process impact
ERP knows your component lots. It cannot connect a paste lot variation to the yield drop it caused on line 3 two shifts later.

Ready to close the gap
between your systems?

See how QualityLine connects your existing inspection and test data in a live session — no slides, no generic demo.

Request a Demo →
How QualityLine Helps

One connected view across
your entire SMT process

QualityLine connects and structures data from every system on your line.

No replacement. No disruption. No changes to your existing setup.

Instead of manually comparing logs across systems, your team can see:

Which upstream parameter caused today's ICT failures
Where in the process variation is accumulating right now
Which corrective action will have the highest yield impact
Which boards in this batch are at risk before they reach test
30%
Improvement in production yield
3–6×
Faster identification of production issues
Zero
Systems replaced — connects to what you have
Days
To first insights, not months
Core Capabilities

Four capabilities.
One question answered: why is yield dropping?

Each capability is designed around the specific systems, failure modes, and process logic of PCB assembly and SMT production.

01
Cross-system analytics

Connects inspection, test, and process data across your SMT line — giving your team a unified view of how each station influences the next.

See SMT Analytics →
02
Root cause visibility

Reveals patterns behind defects across machines, shifts, and time — so your engineers investigate the right thing first, not the most recent symptom.

Find Root Cause Faster →
03
Process capability monitoring

Tracks Cp, Cpk, and variation across critical process parameters in real time — alerting before a drifting parameter becomes a yield event.

Monitor Process Capability →
04
Traceability across production

Links every defect to the materials, machines, process conditions, and production events that produced it — from incoming components through final test.

See Customer Results →
Customer Results

The same data.
A completely different level of control.

"

QualityLine gave us visibility we didn't know was possible. We could finally correlate what was happening at SPI with what we were seeing at ICT — and the root causes that came out of that changed how we approached process control entirely.

Sigalit Fountain Director, Engineering QA & EHS — Emerson
30%
Production yield improvement across connected electronics manufacturing lines
50%
Reduction in client returns — catching escapes before they leave the building
1,000+
Manufacturing sites running QualityLine globally, including Siemens, Emerson, Jabil, Flex, Molex
Common Questions

How do you improve SMT quality
in electronics manufacturing?

Improving SMT quality requires connecting data across inspection, test, and process systems to understand how defects are created — not just where they are detected. Without correlation across systems, teams react to issues instead of preventing them.
Does QualityLine work with existing SMT equipment?
Yes. It integrates with systems like AOI, SPI, ICT, X-Ray, Flying Probe, and others — without replacing anything. Data collection is non-invasive and does not affect line throughput.
How is this different from our MES?
MES tracks production. QualityLine analyzes relationships across systems to explain quality outcomes — correlating data across inspection and test stations that your MES doesn't collect or analyze.
How quickly can we see results?
Most teams begin identifying actionable insights within days to weeks, depending on data availability. Measurable yield improvements typically follow within 30–90 days of deployment.
Can it handle multiple products and frequent changeovers?
Yes. Data is structured by product, revision, and line configuration. QualityLine distinguishes changeover-related variation from genuine process drift, and carries forward learnings across product families to support faster NPI ramp.
Does it support traceability?
Yes. It connects defects to process conditions, materials, machines, and production events — maintaining full chain-of-custody from incoming components through final test, by board serial number.
Is QualityLine suitable for contract manufacturers?
Yes, and it was built with EMS complexity in mind. Dashboards, alerts, and quality reports are segmented by customer program — supporting the documentation requirements of most OEM quality agreements.

Still have questions about your specific environment?

We'll walk through your line configuration and show you exactly how QualityLine would connect to it.

Request a Demo →
See What Your Production Data Is Missing

Your data already knows
what's causing the problem.

QualityLine helps electronics manufacturers connect data across every system — and finally understand what's driving yield, defects, and variation.

Request a Demo →