Why Root Cause Analysis Takes Too Long on SMT Lines (And What Actually Helps)
Why Root Cause Analysis Takes Too Long on SMT Lines Most SMT lines today generate large volumes of inspection and test data. AOI systems capture defect locations and images. SPI measures solder paste volume and alignment. ICT and functional test systems log electrical failures. Yet…
Why AOI, SPI, and Test Data Still Don’t Improve SMT FPY (and What Engineers Can Do About It)
SMT Quality • FPY • Root Cause Analysis Why AOI, SPI, and Test Data Still Don’t Improve SMT FPY (and what to do about it) Many SMT teams have more inspection and test data than ever — yet FPY plateaus and investigations stay slow. The…
AI Visual Inspection for SMT Lines: From Detection to Root Cause
Visual inspection is a critical control point in SMT manufacturing. AOI systems can detect thousands of defects per shift, but for process engineers, detection alone is no longer enough. The real challenge starts after a defect is detected. Why did it occur? Is it a…
What Is Automated Root Cause Analysis in Electronics Manufacturing?
In electronics manufacturing, identifying why defects occur is often more difficult than detecting the defects themselves. Most quality teams can see what failed — through AOI, SPI, ICT, FCT, or field returns. The real challenge is understanding what caused the failure, fast enough to prevent…
Preventing recalls in electronics manufacturing with artificial intelligence
The demand for electronic products is growing exponentially. From microchips in computers and smartphones, automotive manufacturers also rely on components manufactured by electronics manufacturers, which are challenged by rising global competition and an increasing need to provide high-quality components. The electronics manufacturing industry has long…
